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Profile
| Academic position | Post Doc |
|---|---|
| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering,Synthesis and Properties of Functional Materials |
| Keywords | Device integration and optimization, Solution-processed film, Bottom-up assembly, Micro-thermoelectric devices, Thermoelectric nanocomposites |
Current contact address
| Country | People's Republic of China |
|---|---|
| City | Shanghai |
| Institution | Chinese Academy of Sciences (CAS) |
| Institute | Shanghai Institute of Ceramics, State Key Lab of High Performance Ceramics and Superfine Microstructure |
Host during sponsorship
| Prof. Dr. Gabi Schierning | Institut für Metallische Werkstoffe, Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden (IFW) e.V., Dresden |
|---|---|
| Prof. Dr. Kornelius Nielsch | Institut für Metallische Werkstoffe, Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden (IFW) e.V., Dresden |
| Start of initial sponsorship | 01/05/2020 |
Programme(s)
| 2019 | Humboldt Research Fellowship Programme for Postdocs |
|---|